Electronic Solder Paste

"Transient Liquid Phase Sintering (TLPS) joint soldering paste can operate under extreme thermal and mechanical loads where other formulations have failed -- soldering where no paste has soldered before.

Until now, the paste has been used to attach layers of semiconductor chips to metallic substrates. However, developers believe the paste could be useful in applications ranging from aviation, to hybrid electric vehicles.

According to University of Maryland Professor Patrick McCluskey, the paste can be processed at temperatures below 300°.

Joints formed by TLPS show limited voiding, low susceptibility to creep and high strength up to 600°C.

McCluskey explained, the paste could therefore be used in space exploration electronics and engine compartments of automobiles that require high temperatures to attach materials.

“It is an excellent solution for electronic interconnects used in high temperature environments and high power density applications,” McCluskey said."

https://www.engineering.com/DesignerEdge/DesignerEdgeArticles/ArticleID/10039/New-Soldering-Paste-Effective-at-Extreme-Temperatures.aspx